—>Click on run dates for more information.
20152016201720182019202020212022
| STMicroelectronics | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| IC 28nm CMOS28FDSOI | 29 | 20 | ||||||||||
| IC 55nm BiCMOS055 | 14 | 2 | ||||||||||
| IC 65nm CMOS065 | 24 | 2 | ||||||||||
| IC 130nm BiCMOS9MW | 1 | 7 | 29 | |||||||||
| IC 0.16µm BCD8sP | 21 | 17 | ||||||||||
| IC 0.16µm BCD8s-SOI | 30 | |||||||||||
| ams | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| IC 0.35µm BARC C35B4OA | 22 | 28 | 25 | |||||||||
| IC 0.35µm C35B4C3 | 22 | 28 | 25 | |||||||||
| IC 0.35µm ARC C35B4O1 | 22 | 28 | 25 | |||||||||
| IC 0.35µm RF C35B4M3 | 2 | 27 | ||||||||||
| IC 0.35µm H35B4D3 | 3 | 8 | ||||||||||
| IC 0.35µm S35D4M5 | 2 | 27 | ||||||||||
| MEMSCAP | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| MEMS Specific MEMS technologies PolyMUMPs | 16 | 17 | 19 | |||||||||
| MEMS Specific MEMS technologies SOIMUMPs | 2 | 9 | 2 | |||||||||
| MEMS Specific MEMS technologies PiezoMUMPs | 12 | 4 | 24 | |||||||||
| IRT Nanoelec/CEA-LETI | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| Si-Photonics IC Si-220 | 15 | 1 | ||||||||||
| Si-Photonics IC Si-310 | 6 | |||||||||||
| SiN-Photonics IC Si3N4-800 | 26 | |||||||||||
| MAD200 Memory Advanced Demonstrator 200mm | 6 | |||||||||||
| ON Semiconductor | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| IC 0.18µm CMOS ONC18MS | 1 | 6 | 7 | 9 | 11 | 6 | ||||||
| IC 0.18µm CMOS HV ONC18-I4T | 1 | 6 | 7 | 9 | 11 | 6 | ||||||
| IC 0.35µm CMOS ONC35U | 25 | 12 | 1 | 13 | 1 | |||||||
| IC 0.35µm CMOS HV ONC35-I3T25U | 25 | 12 | 1 | 13 | 1 | |||||||
| IC 0.35µm CMOS HV ONC35-I3T50U | 1 | 25 | 1 | 1 | ||||||||
| AMF | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| Si-Photonics IC SiP | 22 | 25 | ||||||||||
| em microelectronic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| IC 0.18µm CMOS EMALP018 logic | 2 | 1 | 4 | |||||||||
| Teem Photonics | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| Glass-photonics IC ioNext-NIR | 22 | 21 | 25 | |||||||||
| Glass-photonics IC ioNext-VIS | 22 | 21 | 25 |
Notes:
- ams 0.35µmBARC C35B4OA or ARC C35B4O1 MPW: on request. Reservation should be done 8 weeks before the deadline.
- MPW OPEN 3D post processes are available for projects and wafers processed through CMP on the last CMP MPW run of the year for the following technologies: STMicrolectronics : CMOS28FDSOI (frontside only), BiCMOS055, CMOS065, BiCMOS9MW, LETI : Silicon Photonic and ams : C35B4M3. Those runs are subject to a certain minimum number of participants sharing the MPW
- -* All MPW scheduled runs are subject to modification.
