Runs schedule

—>Click on run dates for more information.

20152016201720182019202020212022

STMicroelectronicsJanFebMarAprMayJunJulAugSepOctNovDec
IC 28nm CMOS28FDSOI 10 9
IC 55nm BiCMOS055 17 26
IC 65nm CMOS065 8 2
IC 130nm BiCMOS9MW 2 2 23
IC 0.16µm BCD8sP 12 1
IC 0.16µm BCD8s-SOI 16
amsJanFebMarAprMayJunJulAugSepOctNovDec
IC 0.35µm BARC C35B4OA 10 22 19
IC 0.35µm C35B4C3 10 22 19
IC 0.35µm ARC C35B4O1 10 22 19
IC 0.35µm H35B4D3 11 2
IC 0.35µm S35D4M5 15
MEMSCAPJanFebMarAprMayJunJulAugSepOctNovDec
MEMS Specific MEMS technologies PolyMUMPs 2 7 20 3
MEMS Specific MEMS technologies SOIMUMPs 18 19 18 24
MEMS Specific MEMS technologies PiezoMUMPs 14 5 25
IRT Nanoelec/CEA-LETIJanFebMarAprMayJunJulAugSepOctNovDec
Si-Photonics IC Si310-PHMP2M 20 16
MAD200 Memory Advanced Demonstrator 200mm 23
ON SemiconductorJanFebMarAprMayJunJulAugSepOctNovDec
IC 0.18µm CMOS ONC18MS 10 14 15 17 22 14
IC 0.18µm CMOS HV ONC18I4T 10 14 15 17 22 14
IC 0.35µm CMOS ONC35U 3 21 8 21 8
IC 0.35µm CMOS HV ONC35I3T25U 3 21 8 21 8
IC 0.35µm CMOS HV ONC35I3T50U 9 2 8 8
AMFJanFebMarAprMayJunJulAugSepOctNovDec
Si-Photonics fabrication process AMF 9 4
em microelectronicJanFebMarAprMayJunJulAugSepOctNovDec
IC 0.18µm CMOS EMALP018 logic 24 15 30

Notes:

  • ams 0.35µmBARC C35B4OA or ARC C35B4O1 MPW: on request. Reservation should be done 8 weeks before the deadline.
  • MPW OPEN 3D post processes are available for projects and wafers processed through CMP on the last CMP MPW run of the year for the following technologies: STMicrolectronics : CMOS28FDSOI (frontside only), BiCMOS055, CMOS065, BiCMOS9MW, LETI : Silicon Photonic and ams : C35B4M3. Those runs are subject to a certain minimum number of participants sharing the MPW
  • -* All MPW scheduled runs are subject to modification.