201520162017201820192020
| STMicroelectronics | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| IC 28nm CMOS28FDSOI | 12 | 15 | ||||||||||
| IC 55nm BiCMOS055 | 12 | 26 | 12 | 22 | ||||||||
| IC 65nm CMOS065 | 18 | 30 | ||||||||||
| IC 130nm BiCMOS9MW | 4 | 3 | 4 | |||||||||
| IC 130nm H9SOI-FEM | 29 | 30 | ||||||||||
| IC 130nm HCMOS9GP | 4 | 3 | 4 | |||||||||
| IC 130nm HCMOS9A | 7 | |||||||||||
| IC 0.16µm BCD8sP | 14 | |||||||||||
| IC 0.16µm BCD8s-SOI | 22 | 2 | ||||||||||
| ams | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| IC 0.35µm BARC C35B4OA | 18 | 13 | 5 | 18 | ||||||||
| IC 0.35µm C35B4C3 | 18 | 13 | 5 | 18 | ||||||||
| IC 0.35µm ARC C35B4O1 | 18 | 13 | 5 | 18 | ||||||||
| IC 0.35µm RF C35B4M3 | 18 | 14 | ||||||||||
| IC 0.35µm H35B4D3 | 5 | 30 | ||||||||||
| IC 0.35µm S35D4M5 | 18 | 14 | ||||||||||
| MEMSCAP | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| MEMS Specific MEMS technologies PolyMUMPs | 15 | 9 | 9 | 1 | ||||||||
| MEMS Specific MEMS technologies SOIMUMPs | 5 | 4 | 4 | 10 | ||||||||
| MEMS Specific MEMS technologies PiezoMUMPs | 29 | 21 | 10 | |||||||||
| TELEDYNE DALSA | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| MEMS TDSI MIDIS TM MIDIS | 30 | |||||||||||
| IRT Nanoelec/LETI-CEA | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
| Silicon Photonic ICs Si310-PHMP2M | 2 | 30 | ||||||||||
| MAD200 Memory Advanced Demonstrator 200mm | 15 |
Notes:
* All MPW scheduled runs are subject to modification.
* MPW OPEN 3D post processes are available for projects and wafers processed through CMP on the last CMP MPW run of the year for the following technologies: STMicrolectronics : CMOS28FDSOI (frontside only), BiCMOS055, CMOS065, BiCMOS9MW, LETI : Silicon Photonic and ams : C35B4M3. Those runs are subject to a certain minimum number of participants sharing the MPW.
