Process Catalog - CMP: Circuits Multi-Projets

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CMOS technology with 6 metal layers, for Power management applications MEMS and Sensor interfaces Other SOC applications in Medical, Automotive and Industrial High performance mixed analog/digital applications

Next run: 2018/11/13

IC 0.18µm aH18A6

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CMOS High Voltage technology with 6 metal layers, for Mixed signal analog digital, HV designs, system on chip

Next run: 2018/11/13

IC 0.35µm BARC C35B4OA

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CMOS Opto BARC technology with 4 metal layers, for Provides enhanced optical sensitivity for embedded photodiodes and high density CMOS camera products.

Next run: 2018/08/07

IC 0.35µm C35B4C3

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CMOS technology with 4 metal layers, for Mixed signal analog digital, large digital designs, system on chip

Next run: 2018/08/07

IC 0.35µm ARC C35B4O1

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CMOS Opto ARC technology with 4 metal layers, for Provides enhanced optical sensitivity for embedded photodiodes and high density CMOS camera products.

Next run: 2018/08/07

IC 0.35µm RF C35B4M3

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CMOS RF technology with 4 metal layers, for Mixed signal analog digital, large digital designs, system on chip, RF.

Next run: 2018/08/28

IC 0.35µm H35B4D3

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CMOS High Voltage technology with 4 metal layers, for Mixed signal analog digital, HV designs, system on chip

Next run: 2018/08/14

IC 0.35µm C35B4E3

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CMOS technology with 4 metal layers, for The process is fully compatible with C35B4C3 Mixed signal analog digital, large digital designs, system on chip

IC 0.35µm S35D4M5

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BiCMOS SiGe technology with 4 metal layers, for Mixed signal analog/RF/digital, large digital designs, system on chip

Next run: 2018/08/28

MEMS Specific MEMS technologies PolyMUMPs

MEMSCAP
MEMS MUMPS, for MEMS, micromechanics, MOEMS.

Next run: 2018/07/06

MEMS Specific MEMS technologies SOIMUMPs

MEMSCAP
MEMS MUMPS, for MEMS, micromechanics, MOEMS

Next run: 2018/06/05

MEMS Specific MEMS technologies PiezoMUMPs

MEMSCAP
MEMS PiezoMUMPS, for MEMS, micromechanics, MOEMS

Next run: 2018/05/22

MEMS Bulk Micromachining Frontside Bulk Micromachining

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CMOS FS Bulk Micromachining technology with 4 metal layers, for MEMS, micromechanics, MOEMS.

MEMS Bulk Micromachining Backside Bulk Micromachining

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CMOS BS Bulk Micromachining technology with 4 metal layers

MEMS TDSI MIDIS ^TM MIDIS

TELEDYNE DALSA
MEMS, for Accelerometers Gyroscopes Resonators Inertial sensor combos (Sensor fusion)

OPEN 3D Frontside UBM post-process

IRT Nanoelec/LETI-CEA
Wafer-level packaging, for 3D/2.5D integration

OPEN 3D Frontside Micro-Bumps post-process

IRT Nanoelec/LETI-CEA
Wafer-level packaging, for 3D/2.5D integration

OPEN 3D Frontside Bumps post-process

IRT Nanoelec/LETI-CEA
Wafer-level packaging Flip-Chip Packaging, for Single die flip-chip, 3D/2.5D integration

OPEN 3D Backside post-process (TSV, RDL & Bumps)

IRT Nanoelec/LETI-CEA
Wafer-level packaging, for 3D/2.5D integration

Passive Silicon Interposer with UBM

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Si-Interposer technology with 4 metal layers, for Passive Silicon Si-Interposer for 3D/2.5D integration

ams 0.35 and 0.18 Wafer-level bumping

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Flip-Chip Packaging, for Single die flip-chip packaging

Silicon Photonic ICs Si310-PHMP2M

IRT Nanoelec/LETI-CEA
Si-Photonics technology with 2 metal layers, for Telecom, DataCom, ComputerCom

Next run: 2018/10/25

0.35µm Active Silicon Interposer with UBM

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Si-Interposer technology with 4 metal layers, for Active Silicon Si-Interposer for 3D/2.5D integration

Gold stud bumping

Flip-Chip Packaging, for Single die flip-chip packaging

Solder bumping post process

Flip-Chip Packaging, for Flip-chip packaging

OPEN 3D Frontside Micro-Bumps post-process

IRT Nanoelec/LETI-CEA
Flip-Chip Packaging, for 3D/2.5D integration