IC 28nm CMOS28FDSOI
STMicroelectronics
Advanced CMOS FDSOI technology with 8 metal layers
Advanced CMOS FDSOI technology with 8 metal layers
Next run: 2020/02/10
IC 55nm BiCMOS055
STMicroelectronics
BiCMOS SiGe technology with 8 metal layers
BiCMOS SiGe technology with 8 metal layers
Next run: 2020/02/17
IC 65nm CMOS065
STMicroelectronics
Advanced CMOS technology with 7 metal layers
Advanced CMOS technology with 7 metal layers
Next run: 2020/02/04
IC 130nm BiCMOS9MW
STMicroelectronics
BiCMOS SiGe technology with 6 metal layers
BiCMOS SiGe technology with 6 metal layers
Next run: 2019/11/04
IC 130nm HCMOS9A
STMicroelectronics
CMOS High Voltage technology with 4 metal layers
CMOS High Voltage technology with 4 metal layers
Next run: 2019/11/07
MEMS Bulk Micromachining Frontside Bulk Micromachining
ams
CMOS FS Bulk Micromachining technology with 4 metal layers
CMOS FS Bulk Micromachining technology with 4 metal layers
MEMS Bulk Micromachining Backside Bulk Micromachining
ams
CMOS BS Bulk Micromachining technology with 4 metal layers
CMOS BS Bulk Micromachining technology with 4 metal layers
OPEN 3D Frontside Bumps post-process
IRT Nanoelec/LETI-CEA
Wafer-level packaging Flip-Chip Packaging
Wafer-level packaging Flip-Chip Packaging
Silicon Photonic IC Si310-PHMP2M
IRT Nanoelec/LETI-CEA
Silicon Photonic technology with 2 metal layers
Silicon Photonic technology with 2 metal layers
Next run: 2019/10/30
STMicroelectronics Wafer-level bumping on 300mm, ST 55nm BiCMOS055, ST 65nm CMOS065 and on ST 28nm CMOS28FDSOI processes
STMicroelectronics
Wafer-level packaging
Wafer-level packaging
IC ON Semiconductor 0.18µm CMOS ONC18MS
ON Semiconductor
CMOS technology with 5 metal layers
CMOS technology with 5 metal layers
Next run: 2019/12/09
IC ON Semiconductor 0.18µm CMOS HV ONC18I4T
ON Semiconductor
CMOS High Voltage technology with 5 metal layers
CMOS High Voltage technology with 5 metal layers
Next run: 2019/12/09
IC ON Semiconductor 0.35µm CMOS ONC35U
ON Semiconductor
CMOS technology with 4 metal layers
CMOS technology with 4 metal layers
Next run: 2019/12/02
IC ON Semiconductor 0.35µm CMOS HV ONC35I3T25U
ON Semiconductor
CMOS High Voltage technology with 4 metal layers
CMOS High Voltage technology with 4 metal layers
Next run: 2019/12/02
IC ON Semiconductor 0.35µm CMOS HV ONC35I3T50U
ON Semiconductor
CMOS High Voltage technology with 4 metal layers
CMOS High Voltage technology with 4 metal layers
Next run: 2019/12/02
Advanced Micro Foundry (AMF) Silicon Photonics Fabrication Process
AMF-CMC
Silicon Photonic technology with 2 metal layers
Silicon Photonic technology with 2 metal layers
Next run: 2019/11/04
IC EM Microelectronic 0.18µm EMALPC18 logic
EM Microelectronic technology with 04-mai metal layers
Next run: 2020/04/24
