IC 28nm CMOS28FDSOI
STMicroelectronics
Advanced CMOS FDSOI technology with 8 metal layers
Advanced CMOS FDSOI technology with 8 metal layers
Next run: 2021/09/20
IC 55nm BiCMOS055
STMicroelectronics
BiCMOS SiGe technology with 8 metal layers
BiCMOS SiGe technology with 8 metal layers
Next run: 2021/06/14
IC 65nm CMOS065
STMicroelectronics
Advanced CMOS technology with 7 metal layers
Advanced CMOS technology with 7 metal layers
Next run: 2021/05/24
IC 130nm BiCMOS9MW
STMicroelectronics
BiCMOS SiGe technology with 6 metal layers
BiCMOS SiGe technology with 6 metal layers
Next run: 2021/06/07
IC 0.16µm BCD8sP
STMicroelectronics
BCD High Voltage technology with 4 metal layers
BCD High Voltage technology with 4 metal layers
Next run: 2021/05/21
IC 0.16µm BCD8s-SOI
STMicroelectronics
BCD SOI High Voltage technology with 4 metal layers
BCD SOI High Voltage technology with 4 metal layers
Next run: 2021/04/30
MEMS Bulk Micromachining Frontside Bulk Micromachining
ams
CMOS FS Bulk Micromachining technology with 4 metal layers
CMOS FS Bulk Micromachining technology with 4 metal layers
MEMS Bulk Micromachining Backside Bulk Micromachining
ams
CMOS BS Bulk Micromachining technology with 4 metal layers
CMOS BS Bulk Micromachining technology with 4 metal layers
OPEN 3D Frontside Bumps post-process
IRT Nanoelec/CEA-LETI
Wafer-level packaging Flip-Chip Packaging
Wafer-level packaging Flip-Chip Packaging
Si-Photonics IC Si-220
IRT Nanoelec/CEA-LETI
Silicon Photonics technology with 2 metal layers
Silicon Photonics technology with 2 metal layers
Next run: 2021/12/01
Si-Photonics IC Si-310
IRT Nanoelec/CEA-LETI
Silicon Photonics technology with 2 metal layers
Silicon Photonics technology with 2 metal layers
Next run: 2021/09/06
SiN-Photonics IC Si3N4-800
IRT Nanoelec/CEA-LETI
Silicon-Nitride Photonics technology
Silicon-Nitride Photonics technology
Next run: 2021/04/26
STMicroelectronics Wafer-level bumping on 300mm, ST 55nm BiCMOS055, ST 65nm CMOS065 and on ST 28nm CMOS28FDSOI processes
STMicroelectronics
Wafer-level packaging
Wafer-level packaging
IC 0.18µm CMOS HV ONC18-I4T
ON Semiconductor
CMOS High Voltage technology with 5 metal layers
CMOS High Voltage technology with 5 metal layers
Next run: 2021/06/07
IC 0.35µm CMOS HV ONC35-I3T25U
ON Semiconductor
CMOS High Voltage technology with 4 metal layers
CMOS High Voltage technology with 4 metal layers
Next run: 2021/04/12
IC 0.35µm CMOS HV ONC35-I3T50U
ON Semiconductor
CMOS High Voltage technology with 4 metal layers
CMOS High Voltage technology with 4 metal layers
Next run: 2021/05/25
IC 0.18µm CMOS EMALP018 logic
em microelectronic
CMOS technology with 4 metal layers
CMOS technology with 4 metal layers
Next run: 2021/06/01
