Process Catalog

CMP is a service organization in ICs and MEMS for prototyping and low volume productions.

CMP provides several regular and advanced CMOS technologies. BiCMOS RF, High voltage and Smart power are among our Specialty technology portfolio.
CMP provides two types of MEMS technologies for prototyping: Integrated bulk micromachining technologies and specific surface micromachining technologies.

Since 1981, 614 customers from 70 countries have been served, more than 7900 projects have been prototyped through 1043 runs and 72 different technologies have been interfaced.
Some history data are available on this link

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IC 28nm CMOS28FDSOI

STMicroelectronics
Advanced CMOS FDSOI technology with 8 metal layers

Next run: 2021/02/26

IC 55nm BiCMOS055

STMicroelectronics
BiCMOS SiGe technology with 8 metal layers

IC 65nm CMOS065

STMicroelectronics
Advanced CMOS technology with 7 metal layers

Next run: 2021/04/08

IC 130nm BiCMOS9MW

STMicroelectronics
BiCMOS SiGe technology with 6 metal layers

Next run: 2021/03/01

IC 130nm HCMOS9A

STMicroelectronics
CMOS High Voltage technology with 4 metal layers

IC 0.16µm BCD8sP

STMicroelectronics
BCD High Voltage technology with 4 metal layers

IC 0.16µm BCD8s-SOI

STMicroelectronics
BCD SOI High Voltage technology with 4 metal layers

IC 0.35µm BARC C35B4OA

ams
CMOS Opto BARC technology with 4 metal layers

Next run: 2021/02/22

IC 0.35µm C35B4C3

ams
CMOS technology with 4 metal layers

Next run: 2021/02/22

IC 0.35µm ARC C35B4O1

ams
CMOS Opto ARC technology with 4 metal layers

Next run: 2021/02/22

IC 0.35µm RF C35B4M3

ams
CMOS RF technology with 4 metal layers

IC 0.35µm H35B4D3

ams
CMOS High Voltage technology with 4 metal layers

Next run: 2021/05/03

IC 0.35µm C35B4E3

ams
CMOS technology with 4 metal layers

Next run: 2021/02/02

IC 0.35µm S35D4M5

ams
BiCMOS SiGe technology with 4 metal layers

Next run: 2021/02/02

MEMS Specific MEMS technologies PolyMUMPs

MEMSCAP
MEMS MUMPS

Next run: 2021/02/16

MEMS Specific MEMS technologies SOIMUMPs

MEMSCAP
MEMS MUMPS

Next run: 2021/03/02

MEMS Specific MEMS technologies PiezoMUMPs

MEMSCAP
MEMS PiezoMUMPS

Next run: 2021/05/04

MEMS Bulk Micromachining Frontside Bulk Micromachining

ams
CMOS FS Bulk Micromachining technology with 4 metal layers

MEMS Bulk Micromachining Backside Bulk Micromachining

ams
CMOS BS Bulk Micromachining technology with 4 metal layers

MEMS TDSI MIDIS ^TM MIDIS

TELEDYNE DALSA
MEMS

OPEN 3D Frontside UBM post-process

IRT Nanoelec/CEA-LETI
Wafer-level packaging

OPEN 3D Frontside Micro-Bumps post-process

IRT Nanoelec/CEA-LETI
Wafer-level packaging

OPEN 3D Frontside Bumps post-process

IRT Nanoelec/CEA-LETI
Wafer-level packaging Flip-Chip Packaging

OPEN 3D Backside post-process (TSV, RDL & Bumps)

IRT Nanoelec/CEA-LETI
Wafer-level packaging

Passive Silicon Interposer with UBM

ams
Si-Interposer technology with 4 metal layers

ams 0.35 Wafer-level bumping

ams
Flip-Chip Packaging

Si-Photonics IC Si310-PHMP2M

IRT Nanoelec/CEA-LETI
Silicon Photonics technology with 2 metal layers

0.35µm Active Silicon Interposer with UBM

ams
Si-Interposer technology with 4 metal layers

Gold stud-bumping

IRT Nanoelec/CEA-LETI
Flip-Chip Packaging

Solder bumping post process

IRT Nanoelec/CEA-LETI
Flip-Chip Packaging Wafer-level packaging

OPEN 3D Frontside Micro-Bumps post-process

IRT Nanoelec/CEA-LETI
Flip-Chip Packaging

MAD200 Memory Advanced Demonstrator 200mm

IRT Nanoelec/CEA-LETI
CMOS NVM

STMicroelectronics Wafer-level bumping on 300mm, ST 55nm BiCMOS055, ST 65nm CMOS065 and on ST 28nm CMOS28FDSOI processes

STMicroelectronics
Wafer-level packaging

IC 0.18µm CMOS ONC18MS

ON Semiconductor
CMOS technology with 5 metal layers

Next run: 2021/02/01

IC 0.18µm CMOS HV ONC18I4T

ON Semiconductor
CMOS High Voltage technology with 5 metal layers

Next run: 2021/02/01

IC 0.35µm CMOS ONC35U

ON Semiconductor
CMOS technology with 4 metal layers

Next run: 2021/01/25

IC 0.35µm CMOS HV ONC35I3T25U

ON Semiconductor
CMOS High Voltage technology with 4 metal layers

Next run: 2021/01/25

IC 0.35µm CMOS HV ONC35I3T50U

ON Semiconductor
CMOS High Voltage technology with 4 metal layers

Next run: 2021/03/01

Si-Photonics fabrication process AMF

AMF
Silicon Photonics technology with 2 metal layers

Next run: 2021/03/22

IC 0.18µm CMOS EMALP018 logic

em microelectronic
CMOS technology with 4 metal layers

Next run: 2021/02/02