MEMSCAP

SOIMUMPs

Next run : 2021-08-24

TECHNOLOGY CHARACTERISTICS:

- Actual die size : 11mm x 11mm
- Available user area : 9mm x 9mm

    SPECIAL FEATURES:

    DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer.

    APPLICATION AREA:

    MEMS, micromechanics, MOEMS

    DESIGN KIT VERSION:

    1.2 (March-20)

    FRONTEND BACKEND TOOLS:

    Cadence IC 6.1.6

    VERIFICATION TOOLS:

    Assura (Cadence)

    TURNAROUND TIME:

    Typical leadtime: 10 weeks from MPW run deadline to packaged parts

    PRICE

    STANDARD price in Euro/project
    3700
    – Actual die size : 11mm x 11mm
    – Available user area : 9mm x 9mm
    – For 15 prototypes

    EP DISCOUNTED price in Euro/project
    (applied to EUROPRACTICE MEMBERS registered)
    3500.