Interposer WB assembly

Type : Interposer

Interposer WB assembly

Silicon Interposer can be wire-bonded to a package or directly to PCB, after the Chip-to-chip assembly. Each project must be evaluated individually. Please contact CMP at the early stage of your project for a feasibility study/quotation.

Check the “process catalog” section for more information on Si-interposer realization.


Leadframe diagram