MIRPHAB (MID INFRARED PHOTONICS DEVICES FABRICATION FOR CHEMICAL SENSING AND SPECTROSCOPIC APPLICATIONS) PilotLine
CMP becomes the broker for European Mid-Infrared Technologies
Mid Infrared PHotonics devices FABrication for chemical sensing and spectroscopic applications
MIRPHAB is a Pilot Line for prototyping and production of Mid-IR Chemical sensing devices able to operate in both gas and liquid mediums, a single-access point to the best technology provided by a consortium of leading companies in the field of photonics. MIRPHAB offers services from market analysis, design, fabrication to final packaging of prototypes. MIRPHAB’s main objective is to transform your ideas into products to quickly introduce them into the market.
The Mid-InfraRed (MIR) light has a strong interaction with molecular vibrations. In MIR, each molecule presents a unique adsorption spectrum providing a simple solution for sensing.
Based on a massive use of IC/MEMS technologies, the pilot line will enable a variety of new key functionalities for the next generation of chemical sensing and spectroscopy, allowing low-cost, power consumption and size reduction. Where required, the development of novel process modules will exploit the capability of a mixed Si/III-V technology bringing new capabilities to sensors, opening the way to a number of applications not addressed with the technologies and components available today.
The spectrometer system offered by MIRPHAB will consist of: LASERs, Photonic integrated circuits/Microoptics, MIR Detectors and Packaging.
Interband Cascade Lasers (ICLs), Quantum Cascade Lasers (QCLs) are the MIR emitters available working by Fabry-Perot, Distributed Feedback Bragg (DFB) or External Cavity (EC) technology. Regarding passive components, three integrated photonic platforms will be available: a silicon-on-insulator (SOI) waveguide platform, a SiGe/Si platform and a Ge/SiGe platform. MIR detectors available are type-II InAs/GaSb superlattice (T2SL), InAsSb and Quantum Cascade Detectors (QCD). Finally, according to the specifications provided accompanied by the users, these components will be chained together either by hybrid or monolithic assembly to realize Systems In Package (SIP) or Systems On Chip (SOC) devices.
For more information on technical characteristic of each available module:www.mirphab.eu
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Save the date & come and see us!
- April 20-22, 2021
MIRPHAB at Virtual MedtecLIVE & SUMMIT
- April 12, 2021
MIRPHAB at AngelTech Virtual Live III
- March 6-11, 2021
MIRPHAB at Photonics West Digital Marketplace
- March 3-5, 2020
MIRPHAB at Pittcon 2020 (booth #1128)
Chicago, Illinois, USA
- November 20-21, 2019
IDTechEx Show! (booth #Y33)
Santa Clara, USA
- May 21-23, 2019
MedtecLIVE (Hall 10.0 booth #427)
- April 10-11, 2019
The IDTechEx Show! (booth #T05)
the latest emerging technologies at one event
Estrel Convention Center, Berlin, Germany
- March 17-21, 2019
Pittcon(r) (booth #533)
Pennsylvania Convention Center, Philadelphia, PA, USA
- November 27-30, 2018
Pollutec (booth #81, H5, D81)
Parc des Expositions EUREXPO Lyon, FR
- November 14-15, 2018
Sensors USA (booth #ZB24)
Santa Clara Convention Center, CA, USA
- November 13, 2018
MEDICA / EPIC Tech Watch (Halle 8a, Stand 8aG40)
- September 24-26, 2018
ECOC (booth #720)
- April 17-19, 2018
Medtec Europe (booth #9B32)
- April 11-12, 2018
Sensors Europe (booth #018)