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MEMS TDSI MIDIS

Cmp

TECHNOLOGY CHARACTERISTICS:

MEMS Integrated Design for Inertial Sensors (MIDIS TM).
1cm Die size: From 16mm² to 64mm²   

The MIDIS TM Platform is being offered as Multi-Project-Wafer (MPW) service through CMC Microsystems.

SPECIAL FEATURES:

Getter-free high-vacuum sealing allows resonator Q factors > 20,000. Efficient wafer-level packaging minimizes overall die size. 1.5 µm feature size in a 30 µm thick membrane. Comb height control allows out-of-plane sensing. TSV allows compact design ready for co-packaging.

    APPLICATION AREA:

    Accelerometers Gyroscopes Resonators Inertial sensor combos (Sensor fusion)

    TURNAROUND TIME:

    Typical leadtime: 15 weeks from MPW run deadline to packaged parts

    PRICE :

    STANDARD price in Euro

    5200
    Fixed size: (4mm x 4mm)
    Price for Educational Institutions and Research Labs.

    55200

     EP DISCOUNT price in Euro/mm²

    (applied to EUROPRACTICE MEMBERS registered)
    NA.

    DESIGN KIT VERSION:

    MK15S1 V1P3

    FRONTEND BACKEND TOOLS:

    Conventor Catapult (Designer) from CoventorWAreTM Cadence IC 6.1.5 ANSYS

    DOCUMENTATION:

    MIDIS  datasheet

    Estimate request:

    Ask for Design-Kits (DK):
    Request form