Fixed die size: 0,9cm x 0,9cm SOIMUMPS + piezoelectric layer
DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer.
MEMS, micromechanics, MOEMS
1, MEMS Pro v7.0
Cadence IC 6.1.5 Cadence IC 5.1.41 SoftMEMS: Datasheet Softmems_filesmpv70_ds_hq.
Calibre (Mentor Graphics)
Typical leadtime: 10 weeks from MPW run deadline to packaged parts
3900€Price for Educational Institutions and Research Laboratories.
4600€Price for Industrial Companies.
Additional prices for Subdicing and Release:
- Subdicing: 220€per cut lane and per 15 chips,
- HF Release: 870€ flat rate for up to 60 die/subdie,
- Supercritical CO2 Dry: 1100€ flat rate for up to 60 die/subdie.
For 15 identical chips, 1cm x 1cm (fixed size).
Contact CMP for multiple location prices