MEMS Specific MEMS technologies SOIMUMPs

MEMS MEMSCAP Specific MEMS technology MEMS MUMPS SOIMUMPs

TECHNOLOGY CHARACTERISTICS :

 Actual die size : 11mm x 11mm
 Available user area : 10mm x 10mm

SPECIAL FEATURES :

DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer.

APPLICATION AREA :

MEMS, micromechanics, MOEMS

DESIGN KIT VERSION :

1.2 (March-20)

Frontend Backend tools :

Cadence IC 6.1.6

Verification tools :

Assura (Cadence)

TURNAROUND TIME :

Typical leadtime: 10 weeks from MPW run deadline to packaged parts