Actual die size : 11mm x 11mm
Available user area : 10mm x 10mm
DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer.
MEMS, micromechanics, MOEMS
1.2 (March-20)
Cadence IC 6.1.6
Assura (Cadence)
Typical leadtime: 10 weeks from MPW run deadline to packaged parts
PRICE :
STANDARD price in Euro/project
3700
- Actual die size : 11mm x 11mm - Available user area : 9mm x 9mm - For 15 prototypes
EP DISCOUNTED price in Euro/project
(applied to EUROPRACTICE MEMBERS registered)
3500.
François BERTHOLLET
Nicolas PARTENZA
Support:
cmp-support@mycmp.fr
Estimate request:
isabelle.amielh@mycmp.fr
Ask for Design-Kits (DK):
Request form
SOIMUMPs overview: SOIMUMPs overview
Datasheet: SOIMUMPs datasheet