MEMS Specific MEMS technologies SOIMUMPs

MEMS MEMSCAP Specific MEMS technology MEMS MUMPS SOIMUMPs

TECHNOLOGY CHARACTERISTICS :

Fixed die size: 0,9cm x 0,9cm SOIMUMPS + piezoelectric layer

SPECIAL FEATURES :

DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer.

APPLICATION AREA :

MEMS, micromechanics, MOEMS

DESIGN KIT VERSION :

MEMS Pro v7.0

Frontend Backend tools :

Cadence IC 6.1.5
SoftMEMS: Datasheet Softmems_filesmpv70_ds_hq.

Verification tools :

Calibre (Mentor Graphics)

TURNAROUND TIME :

Typical leadtime: 10 weeks from MPW run deadline to packaged parts