MEMS Specific MEMS technologies SOIMUMPs

MEMS MEMSCAP Specific MEMS technology MEMS MUMPS SOIMUMPs

TECHNOLOGY CHARACTERISTICS :

Fixed die size: 0,9cm x 0,9cm SOIMUMPS + piezoelectric layer

SPECIAL FEATURES :

DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer.

APPLICATION AREA :

MEMS, micromechanics, MOEMS

DESIGN KIT VERSION :

1, MEMS Pro v7.0

Frontend Backend tools :

Cadence IC 6.1.5 Cadence IC 5.1.41 SoftMEMS: Datasheet Softmems_filesmpv70_ds_hq.

Verification tools :

Calibre (Mentor Graphics)

TURNAROUND TIME :

Typical leadtime: 10 weeks from MPW run deadline to packaged parts

Next run: 2019/03/05

PRICE :

3900€Price for Educational Institutions and Research Laboratories.
4600€Price for Industrial Companies.
Additional prices for Subdicing and Release:
- Subdicing: 220€per cut lane and per 15 chips,
- HF Release: 870€ flat rate for up to 60 die/subdie,
- Supercritical CO2 Dry: 1100€ flat rate for up to 60 die/subdie.
For 15 identical chips, 1cm x 1cm (fixed size).
Contact CMP for multiple location prices