MEMS Specific MEMS technologies PolyMUMPs

MEMS MEMSCAP Specific MEMS technology MEMS MUMPS PolyMUMPs

TECHNOLOGY CHARACTERISTICS:

 Actual die size : 11mm x 11mm
 Available user area : 10mm x 10mm
Polysilicon/gold
Surface micromachining

SPECIAL FEATURES:

Polysilicon Surface Micomachining. One poly ground layer, two structural poly layers, one gold metal layer, two oxide release layers.

APPLICATION AREA:

MEMS, micromechanics, MOEMS.

DESIGN KIT VERSION:

1.2 (March-20)

FRONTEND BACKEND TOOLS:

Cadence IC 6.1.6

VERIFICATION TOOLS:

Assura (Cadence)

TURNAROUND TIME:

Typical leadtime: 10 weeks from MPW run deadline to packaged parts