Actual die size : 11mm x 11mm
Available user area : 10mm x 10mm
Polysilicon/gold
Surface micromachining
Polysilicon Surface Micomachining. One poly ground layer, two structural poly layers, one gold metal layer, two oxide release layers.
MEMS, micromechanics, MOEMS.
1.2 (March-20)
Cadence IC 6.1.6
Assura (Cadence)
Typical leadtime: 10 weeks from MPW run deadline to packaged parts