MEMS Specific MEMS technologies PolyMUMPs

MEMS MEMSCAP Specific MEMS technology MEMS MUMPS PolyMUMPs

TECHNOLOGY CHARACTERISTICS :

Fixed die size: 1cm x 1cm
Polysilicon/gold
Surface micromachining

SPECIAL FEATURES :

Polysilicon Surface Micomachining. One poly ground layer, two structural poly layers, one gold metal layer, two oxide release layers.

APPLICATION AREA :

MEMS, micromechanics, MOEMS.

DESIGN KIT VERSION :

MEMS Pro v7.0

Frontend Backend tools :

Cadence IC 6.1.5
SoftMEMS: Datasheet Softmems_filesmpv70_ds_hq.

Verification tools :

Calibre (Mentor Graphics)

TURNAROUND TIME :

Typical leadtime: 10 weeks from MPW run deadline to packaged parts