MEMS Specific MEMS technologies PiezoMUMPs

MEMS MEMSCAP Specific MEMS technology MEMS PiezoMUMPS PiezoMUMPs

TECHNOLOGY CHARACTERISTICS :

Fixed die size: 0,9cm x 0,9cm
Deep Reactive Ion Etching on Silicon on Insulator.

SPECIAL FEATURES :

DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer. Further information :

APPLICATION AREA :

MEMS, micromechanics, MOEMS

DESIGN KIT VERSION :

1; MEMS Pro v7.0

Frontend Backend tools :

Cadence IC 6.1.5 Cadence IC 5.1.41 SoftMEMS: Datasheet Softmems_filesmpv70_ds_hq.

Verification tools :

Calibre (Mentor Graphics)

TURNAROUND TIME :

Typical leadtime: 10 weeks from MPW run deadline to packaged parts