MEMS Specific MEMS technologies PiezoMUMPs

MEMS MEMSCAP Specific MEMS technology MEMS PiezoMUMPS PiezoMUMPs

TECHNOLOGY CHARACTERISTICS:

 Actual die size : 11mm x 11mm
 Available user area : 9mm x 9mm

SPECIAL FEATURES:

DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer. Further information :

APPLICATION AREA:

MEMS, micromechanics, MOEMS

DESIGN KIT VERSION:

1.2 (March-20)

FRONTEND BACKEND TOOLS:

Cadence IC 6.1.6

VERIFICATION TOOLS:

Assura (Cadence)

TURNAROUND TIME:

Typical leadtime: 10 weeks from MPW run deadline to packaged parts