Actual die size : 11mm x 11mm
Available user area : 9mm x 9mm
DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer. Further information :
MEMS, micromechanics, MOEMS
1.2 (March-20)
Cadence IC 6.1.6
Assura (Cadence)
Typical leadtime: 10 weeks from MPW run deadline to packaged parts