MEMS Specific MEMS technologies PiezoMUMPs

MEMS MEMSCAP Specific MEMS technology MEMS PiezoMUMPS PiezoMUMPs

TECHNOLOGY CHARACTERISTICS :

Fixed die size: 0,9cm x 0,9cm
Deep Reactive Ion Etching on Silicon on Insulator.

SPECIAL FEATURES :

DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer. Further information :

APPLICATION AREA :

MEMS, micromechanics, MOEMS

DESIGN KIT VERSION :

1.1 (May-19)

Frontend Backend tools :

Cadence IC 6.1.6

Verification tools :

Assura (Cadence)

TURNAROUND TIME :

Typical leadtime: 10 weeks from MPW run deadline to packaged parts