MEMS Bulk Micromachining Frontside Bulk Micromachining

MEMS ams Bulk Micromachining CMOS FS Bulk Micromachining 4 ML Frontside Bulk Micromachining

TECHNOLOGY CHARACTERISTICS :

ams 0.35µ processes
Process cross section
Thick Metal module instead of Metal 4 module and with MIM capacitor module
Poly layer(s): 2, high resistive poly
Maximum die size: 2cm x 2cm
DLP Usable cells: about 300 digital cells
Available I/O: I/O cell library with digital pads is available 3.3V, 3V/5V, 5V with internal level shifters
Temp. range: -40° C. / +125° C.
Supply voltage: 5V or 3.3V
Die size: Minimum charge of 3 mm².

SPECIAL FEATURES :

0.35 µm CMOS post process from ams + TMAH (Tetra Methyl Ammonium Hydroxide) post process etching ; No additional mask for the MEMS post process.

APPLICATION AREA :

MEMS, micromechanics, MOEMS.

DESIGN KIT VERSION :

ams C35B4 4.10 ISR15

LIBRARIES :

ams C35B4 libraries

TURNAROUND TIME :

Typical leadtime: 14-16 weeks from MPW run deadline to packaged parts