ams 0.35µ processes
Process cross section
Thick Metal module instead of Metal 4 module and with MIM capacitor module
Poly layer(s): 2, high resistive poly
Maximum die size: 2cm x 2cm
DLP Usable cells: about 300 digital cells
Available I/O: I/O cell library with digital pads is available 3.3V, 3V/5V, 5V with internal level shifters
Temp. range: -40° C. / +125° C.
Supply voltage: 5V or 3.3V
Die size: Minimum charge of 3 mm².
0.35 µm CMOS post process from ams + TMAH (Tetra Methyl Ammonium Hydroxide) post process etching ; No additional mask for the MEMS post process.
MEMS, micromechanics, MOEMS.
ams C35B4 4.10 ISR15
ams C35B4 libraries
Typical leadtime: 14-16 weeks from MPW run deadline to packaged parts