MEMS Bulk Micromachining Backside Bulk Micromachining

MEMS ams Bulk Micromachining CMOS BS Bulk Micromachining 4 ML Backside Bulk Micromachining

TECHNOLOGY CHARACTERISTICS :

ams 0.35µ processes
4LM + Post Process On-chip suspended membrane with piezoresistors.

SPECIAL FEATURES :

0.35 µm CMOS post process from ams + TMAH (Tetra Methyl Ammonium Hydroxide) post process etching ; No additional mask for the MEMS post process.

DESIGN KIT VERSION :

ams C35B4 4.10 ISR15

LIBRARIES :

ams C35B4 libraries

TURNAROUND TIME :

Typical leadtime: 14-16 weeks from MPW run deadline to packaged parts