IC ams 0.35µm CMOS RF 4 ML C35B4M3
TECHNOLOGY CHARACTERISTICS :
CMOS 0.35 C35B4M3
Same as C35B4C3 with Thick Metal module instead of Metal 4 module and with MIM capacitor module
Poly layer(s): 2, high resistive poly
Maximum die size: 2cm x 2cm
Usable cells: about 300 digital cells
Available I/O: I/O cell library with digital pads is available 3V, 3V/5V, 5V with internal level shifters
Temp. range: -40° C. / +125° C.
Supply voltage: 5V or 3.3V.
SPECIAL FEATURES :
High performance analog/digital/RF process
APPLICATION AREA :
Mixed signal analog digital, large digital designs, system on chip, RF.
DESIGN KIT VERSION :
4.10 ISR 15
Frontend Backend tools :
Cadence IC 6.1.6
Simulation tools :
Spectre (Cadence), Eldo (Mentor Graphics), Hspice (Synopsys)
Verification tools :
Assura (Cadence), Calibre (Mentor Graphics)
Parasitics extraction tools :
QRC (Cadence)
Place route tools :
Encounter Digital Implementation (Cadence)
LIBRARIES :
Analog libraries:
- A_CELLS: Low Voltage Analog Standard Cells
- ESDLIB, PRIMLIB, PRIMLIBRF: Primitive Devices
- IOLIB_ANA*: Analog I/O pads & Power Supply Pads
- IOLIBC_ANA*: Core Limited Analog I/O pads & Power Supply Pads
- IOLIB*_ANA_3B*: 3-Bus Analog I/O pads & Power Supply Pads
- SPIRALS_4M, SPIRALSD_4M, SPIRALS_4M_THICKMET4: Inductors
Digital libraries:
- CORELIB*: 3.3V Digital Standard Cells
- CORELIB_V5*: 5V Digital Standard Cells
- CORELIB*_3B: Digital Standard Cells with 3 Busses (VDD, VSS, GND)
- CORELIBD*: Dense 3.3V Digital Standard Cells
- IOLIB_4M: Digital Input/Output/Bidirectional buffers & Power Pads
- IOLIBC*: Core Limited Digital Input/Output/Bidirectional buffers & Power Pads
- IOLIB*_V5*: Digital Input/Output/Bidirectional buffers & Power Pads; 5V Supply
- IOLIB*_3B*: 3-Bus Digital Input/Output/Bidirectional buffers & Power Pads
TURNAROUND TIME :
Typical leadtime: 10-12 weeks from MPW run deadline to packaged parts
