IC 0.35µm RF C35B4M3

IC ams 0.35µm CMOS RF 4 ML C35B4M3

TECHNOLOGY CHARACTERISTICS :

CMOS 0.35 C35B4M3
Same as C35B4C3 with Thick Metal module instead of Metal 4 module and with MIM capacitor module
Poly layer(s): 2, high resistive poly
Maximum die size: 2cm x 2cm
Usable cells: about 300 digital cells
Available I/O: I/O cell library with digital pads is available 3V, 3V/5V, 5V with internal level shifters
Temp. range: -40° C. / +125° C.
Supply voltage: 5V or 3.3V.

SPECIAL FEATURES :

High performance analog/digital/RF process

APPLICATION AREA :

Mixed signal analog digital, large digital designs, system on chip, RF.

DESIGN KIT VERSION :

4.10 ISR 15

Frontend Backend tools :

Cadence IC 6.1.6

Simulation tools :

Spectre (Cadence), Eldo (Mentor Graphics), Hspice (Synopsys)

Verification tools :

Assura (Cadence), Calibre (Mentor Graphics)

Parasitics extraction tools :

QRC (Cadence)

Place route tools :

Encounter Digital Implementation (Cadence)

LIBRARIES :

Analog libraries:

  • A_CELLS: Low Voltage Analog Standard Cells
  • ESDLIB, PRIMLIB, PRIMLIBRF: Primitive Devices
  • IOLIB_ANA*: Analog I/O pads & Power Supply Pads
  • IOLIBC_ANA*: Core Limited Analog I/O pads & Power Supply Pads
  • IOLIB*_ANA_3B*: 3-Bus Analog I/O pads & Power Supply Pads
  • SPIRALS_4M, SPIRALSD_4M, SPIRALS_4M_THICKMET4: Inductors

Digital libraries:

  • CORELIB*: 3.3V Digital Standard Cells
  • CORELIB_V5*: 5V Digital Standard Cells
  • CORELIB*_3B: Digital Standard Cells with 3 Busses (VDD, VSS, GND)
  • CORELIBD*: Dense 3.3V Digital Standard Cells
  • IOLIB_4M: Digital Input/Output/Bidirectional buffers & Power Pads
  • IOLIBC*: Core Limited Digital Input/Output/Bidirectional buffers & Power Pads
  • IOLIB*_V5*: Digital Input/Output/Bidirectional buffers & Power Pads; 5V Supply
  • IOLIB*_3B*: 3-Bus Digital Input/Output/Bidirectional buffers & Power Pads

TURNAROUND TIME :

Typical leadtime: 10-12 weeks from MPW run deadline to packaged parts