Gold stud bumping

IRT Nanoelec/LETI-CEA Flip-Chip Packaging

TECHNOLOGY CHARACTERISTICS :

PNG - 379.3 kb Stud bump bonding interconnections are manufactured at die-level with a Wire- Bonding equipment. The ball is bonded to the die pad with a gold wire which is then cut right above the ball. The resulting interconnection allows flip-chip of the die onto a substrate by thermocompression, thermosonic or even reflow process. Stud bumping does not require UBM or RDL underneath the balls. Gold stud bumping option is available on any MPW run processed through CMP.

APPLICATION AREA :

Single die flip-chip packaging