by CMP | Apr 20, 2021 | events
In this presentation, Eleonore Hardy from CEA Leti will detail the technology characteristics of CEA-Leti’s versatile Si-SiN photonics platform. Pioneering silicon photonics for more than 15 years, CEA-Leti has designed a technology toolbox featuring state-of-the-art...
by CMP | Mar 12, 2021 | Non classé
STMicroelectronics and CMP organize a set of three online sessions, about ST’s 55nm BiCMOS technology.The first module is an overview of the major analog, mix-signal and RF/mmW features of 55nm BiCMOS technology. Then follows a focus on the devices offered in BiCMOS55...
by CMP | Mar 10, 2021 | news
PRESS RELEASE Grenoble (France) and Marin (Switzerland) January 27, 2020 – CMP and EM Microelectronic are pleased to announce the partnership for offering 0.18µm CMOS 4/5ML EMALP018 technology in MPW (Multi-Project Wafer) runs. EM Microelectronic offers a new...
