9 - 10 November 2021 Brussels, Belgium. CMP will exhibit at the 5th PIC International conference, dedicated to the integrated photonics industry. CMP is Gold sponsor of the event.PIC International is part of AngelTech, which delivers a portfolio of insightful,...
PRESS RELEASE Grenoble (France) and Marin (Switzerland) January 27, 2020 – CMP and EM (…)
CMP is pleased to announce the launch of myCMP support module. This is one step further (…)
CMP organized a book dedication session with the editors of the Springer book “The Fourth Terminal – Benefits of the Body-Biasing Techniques for FDSOI Circuits and Systems”. CMP is the first worldwide MPW service organization offering the access to a FD-SOI...
STMicroelectronics and CMP organize a set of three online sessions, about ST’s 55nm BiCMOS technology.The first module is an overview of the major analog, mix-signal and RF/mmW features of 55nm BiCMOS technology. Then follows a focus on the devices offered in BiCMOS55...
In this presentation, Eleonore Hardy from CEA Leti will detail the technology characteristics (…)
STMicroelectronics and CMP organize a set of three online sessions, about ST’s 28nm FDSOI technology.
The first module is an overview of the major analog, digital and RF features of 28nm FDSOI technology.