2015-03-06
IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW)
Read more:
- PR_LETI-CMP_1stServicePost-process_3D-Techno_MPW_Mar-15.pdf
Technology Overview
