MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » which be held in Grenoble, France, on WTC congress center on May 17,18, 2017
MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
- parallel technical sessions
- poster sessions
- an exhibition
- tutorials, and additional technical events (May 16, 2017)
On thursday May 18th in the session G: Design CMP will present a paper at 10h10
Session G: Design
9h00 Keynote 2: Christophe Zinck (ASE): Fan-In WLCSP a mature technology? What’s next? (Auditorium)
9h45 BGA Package Design Techniques for Electrical Performance Awareness, G. Graziosi, STMicroelectronics
10h10 Design and Verification Methodology of Heterogeneous Chips and Assemblies for Flip-Chip and 2.5D/3D Applications, Olivier GUILLER
10h35 LGA/BGA Substrate Package Design Productivity Enhancement with Cadence Ravel: DRC checks, Layout Generation & Optimization, L. Schwarz STMicroelectronics
