INTRODUCTION FROM THE IEEE 67TH ECTC PROGRAM CHAIR MARK POLIKS
This premier international annual conference, sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, brings together key stakeholders of the global microelectronic packaging industry, such as semiconductor companies, foundry and OSAT service providers, equipment manufacturers, material suppliers, research institutions and universities, all under one roof. More than 1,400 people attended the 66th ECTC in Las Vegas, Nevada, in May 2016.
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