CMP @ ECTC conference from 28-31 May, (booth 520).
CMP staff at ECTC 2018
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
The 69th ECTC program will include six parallel technical sessions in the mornings and afternoons over three days, along with other special topic panel discussions to present highlevel trends and best practices in the industry. Professional Development Courses (PDCs) will also be offered by world-class experts, enabling participants to broaden their technical knowledge base. The technical program and PDCs will be supplemented by Technology Corner Exhibits, which provide an opportunity for leading companies in the electronic components, materials, and packaging fields to exhibit their latest technologies and products.
Last year’s 68th ECTC matched our record number of 106 exhibitors.