CMP provides new MPW access to EM Microelectronic 0.18µm CMOS 4/5 ML EMALP018 technology

PRESS RELEASE



Grenoble (France) and Marin (Switzerland) January 27, 2020 - CMP and EM Microelectronic are pleased to announce the partnership for offering 0.18µm CMOS 4/5ML EMALP018 technology in MPW (Multi-Project Wafer) runs. EM Microelectronic offers a new cost-effective solution to design and manufacture prototypes in CMOS 0.18 node through CMP, as well as to support mass production of these ICs.
By giving access to these technologies, CMP fulfils its role of MPW service, consisting in technically and economically enabling the manufacturing of small IC quantities for research and development projects in the field of integrated electronics, power electronics, micro-systems and silicon photonics.
Kholdoun Torki, Director at CMP, welcomed the arrival of EM Microelectronic among CMP’s partners, adding "This partnership with EM Microelectronic will give to CMP users some unique solutions making ultra-low power applications. The use of the near and sub-threshold voltage for the MOS devices with the EKV models is one of the key features and strength of the EM Microelectronic offer”.
EM Microelectronic, a leader in True Ultra Low Power (TULP™) technology, is the only Swiss-based semiconductor manufacturer, and one of the very few European ones. Offering this MPW service offers customers a preview of its manufacturing capabilities for Swiss-quality ICs. The CMOS 0.18 technology is particularly adapted for Small- and Medium-sized Enterprises (SMEs), enabling versatile and affordable “zero power” products.

About EM Microelectronic

Headquartered in Switzerland, EM designs and produces True Ultra-Low-Power, low-voltage, digital, analog and mixed-signal integrated circuits for battery-operated and field-powered devices in wearable, consumer, automotive and industrial applications. The company is specialized in customer-specific integrated circuit and display solutions and operates its own fab in Switzerland. EM’s product portfolio includes Bluetooth Smart controller ICs and beacons, sensor fusion co-processors, display drivers and capacitive touch controllers, NFC & RFID tag and reader ICs, long range 2.4GHz transceivers, embedded flash microcontrollers, power management ICs, smartcard ICs, timing circuits, sensor interface and optoelectronic ICs, as well as plastic LCDs and display modules.

About CMP

CMP, Circuits Multi-Projects®, is a service organization in ICs, Si photonics, Smart Power and MEMS for prototyping and low volume production. CMP enables prototypes fabrication on industrial processes at very attractive costs and offers great technical expertise in providing MPW and related services for Universities, Research Laboratories and Industrial companies’ prototyping. Chips are normally untested and delivered packaged or not. Advanced industrial technologies are made available in CMOS, SiGe BiCMOS, HV-CMOS, SOI, BCD, Si-Photonics, MEMS, 3D-IC, NVM, etc. Since 1981, more than 645 Institutions from 71 countries have been served, more than 8,300 projects have been prototyped through 1,140 runs, and 74 different technologies have been interfaced. For more information, visit https://mycmp.fr