News

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LETI AND CMP ANNOUNCE WORLD’S FIRST MULTI-PROJECT WAFER SERVICE WITH INTEGRATED SILICON OXRAM

GRENOBLE, France – Aug. 2, 2018 – Leti, a research institute at CEA Tech, and CMP, a service (...) Read more
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CMP becomes the broker for European Mid-Infrared Technologies

Press-release CMP joins MIRPHAB Mid-Infrared Technologies Read more
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CMP Annual Report and Process Catalog

CMP has the pleasure to propose you its newly released combined documents including the 2017 (...) Read more
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ST 0.16um BCD8s-SOI technology platform is available through CMP

IC 0.16µm BCD8s-SOI ST 0.16µm BCD8s-SOI Technology Platform is dedicated to smart power mixed (...) Read more

Events

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A two-day training on ST’s 28nm FDSOI technology

ST Microelectronics, Grenoble, France 20- 21 November 2018 Read more

Upcoming Runs

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2018-10-17 Upcoming Runs
2018-10-22 S55S18_4
2018-10-25 L13F18_2
2018-10-29 S28I18_2
2018-10-29 S65C18_3
2018-10-29 S13I18_3
2018-10-30 A35V18_4
2018-11-07 S13V18_1
2018-11-13 A18C18_2
2018-11-13 A18V18_2
2018-11-13 A35C18_4