News

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LETI AND CMP ANNOUNCE WORLD’S FIRST MULTI-PROJECT WAFER SERVICE WITH INTEGRATED SILICON OXRAM

GRENOBLE, France – Aug. 2, 2018 – Leti, a research institute at CEA Tech, and CMP, a service (...) Read more
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CMP becomes the broker for European Mid-Infrared Technologies

Press-release CMP joins MIRPHAB Mid-Infrared Technologies Read more
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CMP Annual Report and Process Catalog

CMP has the pleasure to propose you its newly released combined documents including the 2017 (...) Read more
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ST 0.16um BCD8s-SOI technology platform is available through CMP

IC 0.16µm BCD8s-SOI ST 0.16µm BCD8s-SOI Technology Platform is dedicated to smart power mixed (...) Read more

Events

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20-21-Nov-18 - A two-day training on ST’s 28nm FDSOI technology

STMicroelectronics and CMP organise a two-day training on the ST’s 28nm FDSOI technology, in (...) Read more
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07-Feb-19 - Annual users’ meeting - Paris

Information Users’ meeting is open to every person from academia or industry, using or (...) Read more
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14-Feb-19 - 3rd Introduction Day on IC prototyping by CMP

3ème Journée d’Initiation au service de prototypage de circuits par CMP à INSA/Pôle CNFM de (...) Read more

Upcoming Runs

All runs

2018-11-18 Upcoming Runs
2018-12-11 A35R18_3
2018-12-11 A35S18_3
2019-01-02 S28I19_1
2019-01-15 M02P19_1
2019-01-29 M03Z19_1