News

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LETI AND CMP ANNOUNCE WORLD’S FIRST MULTI-PROJECT WAFER SERVICE WITH INTEGRATED SILICON OXRAM

GRENOBLE, France – Aug. 2, 2018 – Leti, a research institute at CEA Tech, and CMP, a service (...) Read more
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CMP becomes the broker for European Mid-Infrared Technologies

Press-release CMP joins MIRPHAB Mid-Infrared Technologies Read more
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CMP Annual Report and Process Catalog

CMP has the pleasure to propose you its newly released combined documents including the 2017 (...) Read more
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ST 0.16um BCD8s-SOI technology platform is available through CMP

IC 0.16µm BCD8s-SOI ST 0.16µm BCD8s-SOI Technology Platform is dedicated to smart power mixed (...) Read more

Events

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19-21 Sept. 2018 MEMS & Sensors in Europe, Grenoble, France

MEMS and sensors devices are applied in a diverse and growing list of products – mobile, (...) Read more
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24-26 September 2018, ECOC (booth #268)- Rome, Italy

From 24 to 26 September 2018, CMP (booth #268) will exhibit at The largest Conference on (...) Read more

Upcoming Runs

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2018-08-17 Upcoming Runs
2018-08-28 A35R18_2
2018-08-28 A35S18_2
2018-09-04 M03S18_3
2018-09-11 M03Z18_3
2018-10-02 M02P18_4
2018-10-02 S16BCD18_3
2018-10-02 S16BCDSOI18_2
2018-10-25 L13F18_2
2018-10-29 S28I18_2
2018-10-29 S65C18_3