Custom Flip-chip Substrate

Ceramic and plastic custom substrates


Type : Flip-Chip Packaging

Custom Flip-chip Substrate

Ceramic and plastic custom substrates

Custom designed plastic and ceramic substrate:
If your project requires a custom designed substrate, CMP can work with its subcontractors to deliver it. CMP will then help you through the different steps of the project by:
- Verifying Die/Substrate compatibility before fabrication
- Ensuring the technical information exchange with our subcontractor on your behalf
- Optimizing turnover by coordinating the different links of the packaging chain (die and substrate fabrication, flip-chip interconnection realization and assembly on substrate)

The price of this option depends on the substrate specifications, you must request a quotation at the early stage of your project. This option is available on any CMP MPW runs.