MEMS TDSI MIDIS TM MIDIS

MEMS TELEDYNE DALSA TDSI MIDIS TM MEMS MIDIS TM

TECHNOLOGY CHARACTERISTICS :

MEMS Integrated Design for Inertial Sensors (MIDIS TM).
1cm Die size: From 16mm² to 64mm²

GIF - 2.6 kb

The MIDIS TM Platform is being offered as Multi-Project-Wafer (MPW) service through CMC Microsystems.

SPECIAL FEATURES :

Getter-free high-vacuum sealing allows resonator Q factors > 20,000. Efficient wafer-level packaging minimizes overall die size. 1.5 µm feature size in a 30 µm thick membrane. Comb height control allows out-of-plane sensing. TSV allows compact design ready for co-packaging.

APPLICATION AREA :

Accelerometers Gyroscopes Resonators Inertial sensor combos (Sensor fusion)

DESIGN KIT VERSION :

MK15S1 V1P3

Frontend Backend tools :

Conventor Catapult (Designer) from CoventorWAreTM Cadence IC 6.1.5 ANSYS

TURNAROUND TIME :

Typical leadtime: 15 weeks from MPW run deadline to packaged parts