ST 0.16um BCD8s-SOI technology platform is available through CMP

IC 0.16µm BCD8s-SOI

ST 0.16µm BCD8s-SOI Technology Platform is dedicated to smart power mixed signal applications (up to 200V plus analog & digital) on SOI substrates. Its outstanding characteristics relay on the EMI robustness, below ground capability, low consumption and reduced isolation distance.
Technology Overview: pdf/bcd8s-soi_technology_overview-2.pdf

Application examples

3D MEMS scanning, Pico-projector, Consumer and Automotive Audio Amplifier, Automative Sensor Interface ICs, 3D Ultrasound

Contact:
Lyubomir KERACHEV
Tel. : +33 4 76 57 48 34

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